ТЕХНОЛОГИИ

Edição Título Arquivo
Volume 53, Nº 6 (2024) Plasma Parameters and Si/SiO2 Etching Kinetics in Mixtures of Fluorocarbon Gases with Argon and Helium PDF
(Rus)
Efremov A., Betelin V., Kwon K.
Volume 53, Nº 6 (2024) Conductivity Study of Carbon Nanotubes Deposited on Iridium Silicon-Silicide Substrate PDF
(Rus)
Kerimov E.
Volume 53, Nº 5 (2024) Producing of graphene: deposition and annealing PDF
(Rus)
Shustin Е.
Volume 53, Nº 4 (2024) Methodology of Production of Photo-Sensitive Elements on Ptsi Basis PDF
(Rus)
Kerimov E.
Volume 53, Nº 4 (2024) Al Islands on Si(111): Growth Temperature, Morphology and Strain PDF
(Rus)
Lomov A., Zakharov D., Tarasov M., Chekushkin A., Tatarintsev A., Vasiliev A.
Volume 53, Nº 4 (2024) Plasmochemical and Reactive Ion Etching of Gallium Arsenide in Difluorodichloromethane with Helium PDF
(Rus)
Murin D., Chesnokov I., Gogulev I., Anokhin A., Moloskin A.
Volume 53, Nº 2 (2024) Influence of nickel impurities on the operational parameters of a silicon solar cell PDF
(Rus)
Kenzhaev Z., Zikrillaev N., Odzhaev V., Ismailov K., Prosolovich V., Zikrillaev K., Koveshnikov S.
Volume 53, Nº 2 (2024) Temporary changes in current flow mechanisms in erbium-doped porous silicon PDF
(Rus)
Khamzin E., Uslin D.
Volume 53, Nº 2 (2024) Ripple of a DC/DC converter based on SEPIC topology PDF
(Rus)
Bityukov V., Lavrenov A.
Volume 53, Nº 1 (2024) Application of Spectral Ellipsometry for Dielectric, Metal and Semiconductor Films in Microelectronics Technology PDF
(Rus)
Gaidukasov R., Miakonkikh A.
Volume 53, Nº 1 (2024) Features of Electroforming and Functioning of Memristors Based on Open TiN–SiO2–Mo Sandwich Structures PDF
(Rus)
Gorlachev E., Mordvintsev V., Kudryavtsev S.
Volume 53, Nº 1 (2024) Molecular Layering of an Additive Layer of Silicon Dioxide on Anodized Tantalum and Niobium Oxides PDF
(Rus)
Ezhovskii Y., Mikhailovskii S.
Volume 53, Nº 1 (2024) Parameters and Composition of Plasma in a Mixture of CF4 + H2 + Ar: Effect of the CF4/H2 Ratio PDF
(Rus)
Miakonkikh A., Kuzmenko V., Efremov A., Rudenko K.
Volume 53, Nº 1 (2024) Interconnects Materials for Integrated Circuit Technology Below 5 Nm Node PDF
(Rus)
Rogozhin A., Glaz O.
Volume 52, Nº 5 (2023) Effect of the Material of Electrodes on Electroformation and Properties of Memristors Based on Open Metal–SiO2–Metal Sandwich Structures PDF
(Rus)
Mordvintsev V., Kudryavtsev S., Naumov V., Gorlachev E.
Volume 52, Nº 4 (2023) Effect of Magnetron Sputtering Power on ITO Film Deposition at Room Temperature PDF
(Rus)
Saenko A., Vakulov Z., Klimin V., Bilyk G., Malyukov S.
Volume 52, Nº 4 (2023) Mechanisms of the Redistribution of Carbon Contamination in Films Formed by Atomic Layer Deposition PDF
(Rus)
Fadeev A., Myakon’kikh A., Smirnova E., Simakin S., Rudenko K.
Volume 52, Nº 3 (2023) Hydrogen Plasma under Conditions of Electron-Cyclotron Resonance in Microelectronics Technology PDF
(Rus)
Polushkin E., Nefed’ev S., Koval’chuk A., Soltanovich O., Shapoval S.
1 - 18 de 18 resultados